Science & Engineering

The projects listed below include cross-college research collaborations in Science and Engineering, including NDnano faculty projects centralized at Notre Dame and those conducted with other universities.

Notre Dame

Biomemetic infection reporting antimicrobial nanoparticles for wound and surgical site applications
Prakash Nallathamby, Aerospace & Mechanical Engineering
Shaun Lee, Biological Sciences
Sponsor: Indiana Clinical and Translational Sciences Institute (CTSI)

Multi-university

NEW materials for LogIc, Memory and InTerconnectS (New Limits)
Zhihong Chen, Electrical and Computer Engineering, Purdue University
Joerg Appenzeller, Electrical and Computer Engineering, Purdue University
Sumeet Gupta, Electrical and Computer Engineering, Purdue University
Chris Hinkle, Electrical Engineering, Notre Dame
John Heron, Materials Science & Engineering, University of Michigan
Joshua Robinson, Materials Science & Engineering, Penn State University
Robert Wallace, Materials Science & Engineering, University of Texas Dallas
Max Fischetti, Materials Science & Engineering, University of Texas Dallas
Sponsor: Purdue University/Semiconductor Research Corporation

An engineered tissue model of aged mammary microenvironment
Pinar Zorlutuna, Aerospace & Mechanical Engineering, Notre Dame
Siyuan Zhang, Biological Sciences, Notre Dame
Zonggao Shi, Chemistry & Biochemistry, Notre Dame
Xiaoshan Yue, Aerospace & Mechanical Engineering, Notre Dame
Harikrishna Nakshatri, Breast Cancer Research, Indiana University School of Medicine
Sponsor: National Institutes of Health

Applications and Systems Driven Center for Energy-Efficient Integrated NanoTechnologies (ASCENT)
Suman Datta, Notre Dame, Electrical Engineering
Patrick Fay, Notre Dame, Electrical Engineering
Michael Niemier, Notre Dame, Computer Science & Engineering
Led by Notre Dame, with additional collaborators at Arizona State, Colorado, Cornell, Georgia Tech, Illinois Institute of Technology, Purdue, Minnesota, Stanford, UC Berkeley, UCLA, UC San Diego, UC Santa Barbara, UT Dallas, and Wayne State.
Sponsor: Defense Advanced Research Projects Agency (DARPA)/Semiconductor Research Corporation

Thermal evaporation around optically excited functionalized nanoparticles
Tengfei Luo, Notre Dame, Aerospace & Mechanical Engineering
Hsueh-Chia Chang, Notre Dame, Chemical & Biomolecular Engineering
Annette Raigoza, Saint Benedict/Saint John’s, Chemistry
Sponsor: National Science Foundation (NSF)

Sequencing antibodies with a synthetic sub-nanometer pore
Greg Timp, Notre Dame, Electrical Engineering/Biological Sciences
Pavel Pevzner, UC San Diego, Computer Science & Engineering
Winston Timp, Johns Hopkins University, Biomedical Engineering
Sponsor: Open Philanthrophy Project

E2CDA-Type 1: Extremely energy efficient collective electronics (EXCEL)
Suman Datta, Notre Dame, Electrical Engineering
Sharon Hu, Notre Dame, Computer Science & Engineering
Zoltan Toroczkai, Notre Dame, Physics
Wolfgang Porod, Notre Dame, Electrical Engineering
Michael Niemier, Notre Dame, Computer Science & Engineering
Danny Chen, Notre Dame, Computer Science & Engineering
Led by Notre Dame, with additional collaborators at Georgia Tech, Penn State, UC Irvine, UC San Diego, and University of Chicago.
Sponsor: National Science Foundation (NSF)

MICCoM – SSAGES ad COPSS packages
Jonathan Whitmer, Notre Dame, Chemical & Biomolecular Engineering
Led by Argonne National Laboratory, with additional collaborators at Michigan, Northwestern, UC Davis, and University of Chicago.
Sponsor: U.S. Department of Energy

EFRI 2-DARE: Ultra-low power, collective-state device technology based on electron correlation in two-dimensional atomic layers
Joshua Robinson, Penn State, Materials Science & Engineering
James Freericks, Georgetown, Physics
Suman Datta, Notre Dame, Electrical Engineering
Eva Andrei, Rutgers, Physics
Roman Engel-Herbert, Penn State, Materials Science & Engineering
Sponsor: National Science Foundation (NSF)

ALERT Center of Excellence in Explosives Research
Ken Sauer, Notre Dame, Electrical Engineering
Anthony Hoffman, Notre Dame, Electrical Engineering
Scott Howard, Notre Dame, Electrical Engineering
Led by Northeastern, with additional collaborators at Ben-Gurion University of Negev, Boston, Hebrew University of Jerusalem, New Mexico State, Puerto Rico, Purdue, Rensselaer, Rhode Island, Texas Tech, Tufts, and Washington State.
Sponsor: U.S. Department of Homeland Security