Gary H. Bernstein, Freimann Chair of Electrical Engineering at the University of Notre Dame and co-founder of Indiana Integrated Circuits, LLC, will give one of the Masters of Innovation talks at the Forbes Reinventing America: The Innovation Summit event on November 13 in Indianapolis. His talk is entitled "Quilted Electronics: A New Paradigm in Performance."

Abstract: Today's smaller, denser, smarter electronics require revolutions in microprocessor design, like Gary H. Bernstein's quilt packaging assembly technology, which allows huge performance gains and big cost cuts while allowing unprecedented product miniaturization at low power levels. Professor Bernstein will show off his breakthrough—developed in Indiana—and talk about what comes next.