The Notre Dame Integrated Imaging Facility (NDIIF) is pleased to announce two awards for the best imaging publications for calendar year 2015 – April 15, 2016.
Gary H. Bernstein, the Frank M. Freimann Professor of Electrical Engineering at the University of Notre Dame, has been named recipient of the 1st Source Bank Commercialization Award celebrating his “quilt packaging” microchip packing technology.