NDnano Summer REU Seminar: A Short Introduction to Scanning Electron Microscopy

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Location: 258 Fitzpatrick Hall

Presented by:
Gary H. Bernstein
Frank M. Freimann Professor of Electrical Engineering
University of Notre Dame

Abstract
Scanning electron microscopy (SEM), is one of the most common and useful analytical techniques for both the hard and soft sciences. It allows objects to be imaged at size scales even smaller than 1 nm in some cases. This talk will show several examples of images taken with SEM and discuss the underlying process that makes it possible.

Bio
Gary H. Bernstein received his bachelor of science degree in electrical engineering from the University of Connecticut, Storrs, with honors, in 1979 and master's degree in electrical engineering from Purdue University, W. Lafayette, Indiana, in 1981. During the summers of 1979 and 1980, he was a graduate assistant at Los Alamos National Laboratory, and in the summer of 1983 interned at the Motorola Semiconductor Research and Development Laboratory, Phoenix, Arizona. He received his Ph.D. in electrical engineering from Arizona State University, Tempe, in 1987, after which he spent a year there as a postdoctoral fellow. He joined the department of electrical engineering at the University of Notre Dame, Notre Dame, Indiana, in 1988 as an assistant professor, and was the founding director of the Notre Dame Nanoelectronics Facility (NDNF) from 1989 to 1998. Dr. Bernstein received an NSF White House Presidential Faculty Fellowship in 1992. Promoted to rank of professor in 1998, he served as associate chairman from 1999 to 2006. Bernstein was named the Frank M. Freimann Professor of Electrical Engineering in 2010, and currently serves as the associate director of the Notre Dame Center for Nano Science and Technology (NDnano). Prof. Bernstein has authored or co-authored 11 patents, with at least four pending, and more than 275 publications in the areas of electron beam lithography, nanomagnetics, quantum electronics, high-speed integrated circuits, electromigration, MEMS, and electronics packaging.